Poly aryl ether ketone (PAEK) polymers are gaining interest in 3D printing for their good mechanical properties and high service temperatures. The aim of this study was to compare the crystallisation kinetics, morphology, and mechanical properties of two different PAEK polymers used in fused filament fabrication (FFF), i.e. the fast crystallising PEEK151 (poly ether ether ketone) grade originally designed for injection moulding and the slow crystallising AM 200 grade tailored specifically for FFF. The crystallisation kinetics of both grades were examined across a wide temperature range. A method to select annealing temperatures and annealing times based on the intrinsic crystallisation behaviour of each polymer was proposed. The dual-Avrami model highlighted a different crystallite growth for AM 200 in comparison with PEEK151 with a higher rate of secondary crystallisation. Lamellar thicknesses were measured by SAXS and calculated via the Thomson-Gibbs equation. The lamellar thicknesses of primary and secondary crystallisation for AM 200 showed a stronger temperature dependence with steeper slopes when increasing the isothermal temperature. The benefit of using a slow crystallising PAEK polymer over the conventional fast crystallising grades is evidenced by the improvement in Z strength which enhances the overall isotropy of printed parts.

聚芳基醚酮（PAEK）聚合物因其良好的机械性能和较高的使用温度而受到3D打印的关注。这项研究的目的是比较两种用于熔融长丝制造（FFF）的不同PAEK聚合物的结晶动力学，形态和机械性能，即最初为注塑成型而设计的快速结晶PEEK151（聚醚醚酮）级和缓慢结晶的AM 200，专为FFF量身定制。在较宽的温度范围内检查了两种牌号的结晶动力学。提出了一种基于每种聚合物的固有结晶行为选择退火温度和退火时间的方法。与PEEK151相比，双Avrami模型突出了AM 200的微晶生长，并具有更高的二次结晶速率。层厚通过SAXS测量，并通过Thomson-Gibbs方程计算。当增加等温温度时，AM 200的初次和二次结晶的层状厚度表现出较强的温度依赖性，且斜率更陡。Z强度的改善可增强印刷零件的整体各向同性，从而证明了使用缓慢结晶的PAEK聚合物优于传统的快速结晶等级的好处。当增加等温温度时，AM 200的初次和二次结晶的层状厚度表现出较强的温度依赖性，且斜率更陡。Z强度的改善可增强印刷零件的整体各向同性，从而证明了使用缓慢结晶的PAEK聚合物优于传统的快速结晶等级的好处。当增加等温温度时，AM 200的初次和二次结晶的层状厚度表现出较强的温度依赖性，且斜率更陡。Z强度的改善可增强印刷零件的整体各向同性，从而证明了使用缓慢结晶的PAEK聚合物优于传统的快速结晶等级的好处。