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High Entropy Alloys as Filler Metals for Joining
Entropy ( IF 2.7 ) Pub Date : 2021-01-07 , DOI: 10.3390/e23010078
Dan Luo , Yong Xiao , Liam Hardwick , Robert Snell , Matthew Way , Xavier Sanuy Morell , Frances Livera , Nicholas Ludford , Chinnapat Panwisawas , Hongbiao Dong , Russell Goodall

In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 °C) and brazing (>450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.

中文翻译:

高熵合金作为接合填充金属

在寻找在高熵合金 (HEA) 型材料理念下开发的合金的应用时,重点可能放在当前合金也使用多种成分的应用上,尽管含量低于 HEA 中的含量。已经发现具有复杂成分的合金的一个这样的领域是用于连接的填充金属。在焊接 (<450 °C) 和钎焊 (>450 °C) 中,填充金属合金在高于其液相线温度时用于在两个组件之间形成金属结合,在整个过程中保持未熔化和基本不变。这些连接方法广泛应用于从电子到航空航天和能源的应用中,填充金属高度多样化,允许与广泛的基础材料兼容(包括将陶瓷与金属结合的能力)和大范围的加工温度。在这里,我们回顾了与高熵材料相关的填充金属的最新发展,并认为此类合金值得进一步探索,以帮助克服当前需要解决的许多基于填充金属的连接方法的挑战。
更新日期:2021-01-07
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