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Electronic microstructure and thermal conductivity modeling of semiconductor nanomaterials
Microelectronics Journal ( IF 2.2 ) Pub Date : 2021-01-07 , DOI: 10.1016/j.mejo.2020.104988
Changqing Song , Chuan Yin , Huiwen Qu

In order to improve the thermal conductivity of semiconductor materials, the application of nano materials in the thermal conductivity analysis of semiconductor materials is proposed. According to the requirements of electronic microstructure analysis of semiconductor nanomaterials, transmission electron microscope is selected. The innovation of this paper is to establish the thermal conductivity model of semiconductor nanomaterials through the process of unit selection initial analysis specific analysis. Take semiconductor nanomaterials as an example Ti3C2Tx as the experimental object, the structural components and mass of Ti3C2Tx are analyzed by transmission electron microscope. The thermal conductivity of Ti3C2Tx at 80 K–290 K is obtained by T-shape method and thermal conductivity model, which fully confirmed that the experimental object has good structural performance and thermal conductivity.



中文翻译:

半导体纳米材料的电子微观结构和导热系数建模

为了提高半导体材料的导热系数,提出了纳米材料在半导体材料导热系数分析中的应用。根据半导体纳米材料电子显微结构分析的要求,选择了透射电子显微镜。本文的创新之处在于通过单元选择,初步分析,具体分析的过程建立半导体纳米材料的导热模型。以半导体纳米材料为例3C2ŤX 作为实验对象,其结构成分和质量 3C2ŤX用透射电子显微镜分析。导热系数3C2ŤX 通过T形法和热导率模型获得了在80 K–290 K时的温度,充分证实了实验对象具有良好的结构性能和热导率。

更新日期:2021-01-16
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