SAF 2205 and IN X-750 were joined using the TLP method. The joining process was carried out at 1100 °C for different times using BNi-3 interlayer. Microstructural study and identification of the present phases in the bonding regions were performed using optical microscopy and scanning electron microscopy equipped with energy-dispersive X-ray spectroscopy and electron backscatter diffraction technique. Microhardness and shear strength tests were done to measure the mechanical properties. Different phases such as BN, Ni₃B, Ni₂B, CrB, Cr₂B, and Ni₂Si were formed in the bonding area. EBSD analysis results showed that the amount of the formed phases in the bonding area is a function of the bonding time. As the holding time increased, the amount of created phases in the bonding area increased from about 8 to 11 wt.%. The microhardness profile of the joining area also behaved differently as the bonding time changed. The maximum measured microhardness was about 850 HV which appeared in the athermally solidified zone of the bonded sample for 1 min. The maximum shear strength was observed in the bonded sample with complete isothermal solidification, approximately 72% of the shear strength of SAF 2205 and 85% of IN X-750.

使用TLP方法将SAF 2205和IN X-750连接在一起。使用BNi-3中间层在1100°C下进行了不同时间的连接过程。使用配备了能量色散X射线光谱和电子背散射衍射技术的光学显微镜和扫描电子显微镜对键合区域中的当前相进行了显微组织研究和鉴定。进行了显微硬度和抗剪强度测试，以测量机械性能。BN，Ni ₃ B，Ni ₂ B，CrB，Cr ₂ B和Ni _{2等不同相}在接合区域中形成Si。EBSD分析结果表明，键合区域中形成相的数量是键合时间的函数。随着保持时间的增加，在粘结区域中产生的相的数量从约8重量％增加到11重量％。接合区域的显微硬度分布也随着接合时间的变化而有所不同。测得的最大显微硬度约为850 HV，出现在粘合样品的非热固化区域1分钟。在完全等温固化的粘合样品中观察到最大剪切强度，约为SAF 2205剪切强度的72％和IN X-750剪切强度的85％。