Physical vapor deposition (PVD) is one of the major methods for fabricating thin films. Measuring and controlling the thickness of deposited layers are very momentous, especially for optics and photonics applications. Despite regular depositions with substrates situated near the thickness monitor, the oblique angle deposition method requires applying a correction factor for estimating real thicknesses. In this paper, we establish a correction factor formula for different positions of the substrate relative to the deposition source. After numerical simulations, several samples with [Glass/Nickel] and [Glass/Nickel/Zinc Sulfide] structures are fabricated using an oblique angle PVD method. Magneto-optical Kerr measurements and hysteresis loop analysis are obtained from three different points of samples with different thicknesses and compared to the corresponding simulated structures. The results of the correction factor show a high degree of conformity with simulations. Cross-sectional field emission scanning electron microscopic characterization is also used to illustrate the thickness of samples. The thicknesses are then compared to the results obtained from the correction factor, confirming its reliability for practical use in oblique angle deposition methods.

物理气相沉积（PVD）是制造薄膜的主要方法之一。测量和控制沉积层的厚度非常重要，特别是对于光学和光子学应用而言。尽管有规则的沉积方法，且基板位于厚度监测器附近，但斜角沉积方法仍需要应用校正因子来估算实际厚度。在本文中，我们针对基板相对于沉积源的不同位置建立校正因子公式。经过数值模拟后，使用斜角PVD方法制备了具有[玻璃/镍]和[玻璃/镍/硫化锌]结构的几个样品。从具有不同厚度的样品的三个不同点获得磁光克尔测量值和磁滞回线分析，并将其与相应的模拟结构进行比较。校正因子的结果表明与仿真高度吻合。截面场发射扫描电子显微镜表征还用于说明样品的厚度。然后将厚度与从校正因子获得的结果进行比较，确认其在倾斜角沉积方法中实际使用的可靠性。