Abstract

Wafer bonding is an attractive technology that can join homo/heterogeneous materials into one composite. It has a wide range of applications in the micro-electro-mechanical system (MEMS), integrated circuit, consumer and power electronics, micro/nanofluidics, etc. Since all devices on the same wafer are sealed and tested at wafer size, it brings lots of benefits compared with the component-level packaging, such as substantial savings in time, materials, and labor. In this review, we firstly introduce the low- and room-temperature Si bonding and their applications in MEMS fabrication. Subsequently, we present applications of the third-generation semiconductor bonding towards optoelectronics. Due to the research in the electro-optical modulation of lithium niobate (LiNbO₃) has made revolutionary progress in recent years, we also show the bonding method towards single-crystal LiNbO₃ thin-film fabrication. Finally, we set our sights on the bonding of infrared materials, which might be the next research hotspot for the emerging ultrasensitive sensors.

摘要

晶圆键合是一种有吸引力的技术，可以将同质/异质材料连接到一个复合物中。它在微机电系统（MEMS），集成电路，消费电子和电力电子，微/纳米流体等领域具有广泛的应用。由于同一晶片上的所有器件均被密封并按晶片尺寸进行测试，因此带来了与组件级包装相比，有很多好处，例如节省大量的时间，材料和劳动力。在这篇综述中，我们首先介绍了低温和室温下的硅键合及其在MEMS制造中的应用。随后，我们介绍了第三代半导体键合在光电子学中的应用。由于对铌酸锂（LiNbO ₃）近年来取得了革命性的进步，我们还展示了用于单晶LiNbO ₃薄膜制造的键合方法。最后，我们将目光投向红外材料的粘合，这可能是新兴超灵敏传感器的下一个研究热点。