Hypereutectic Al-27Si and Al-50Si alloys have been bonded and the influence of the bonding temperature on the microstructure and properties of the joints investigated. The results showed that Al-27Si/Al-50Si joints were bonded metallurgically with wide soldering seams containing α-Al, β-Si, and θ-Al₂Cu eutectic phases. The amount of θ-Al₂Cu eutectic phase gradually decreased and the bonding interface became nonplanar with increasing temperature. Many cracks formed in the Si phases on the Al-50Si side because of the shrinkage mismatch between the Al and Si phases and the different coefficients of thermal expansion of the Al-27Si and Al-50Si alloys. Some Si phases on the Al-27Si side transformed from granular to needle-like shape at higher temperatures. The shear strength of the joints first increased then decreased with increasing temperature, reaching a maximum of 82.3 MPa at 540°C.

已经焊接了过共晶Al-27Si和Al-50Si合金，并研究了粘结温度对接头的显微组织和性能的影响。结果表明，铝27Si /的Al-50Si接头用含有的α-Al，β-Si和θ-Al系宽焊接接缝冶金结合₂ Cu共晶相。量θ-Al系₂随着温度的升高，Cu共晶相逐渐减少，键合界面变得不平坦。由于Al和Si相之间的收缩失配以及Al-27Si和Al-50Si合金的热膨胀系数不同，在Al-50Si侧的Si相中形成许多裂纹。在较高温度下，Al-27Si侧的一些Si相从颗粒状转变为针状。接头的抗剪强度先随温度的升高而增加，然后降低，在540°C时最大达到82.3 MPa。