In the ultrasonic-assisted water confined laser micromachining silicon, micro-cracks may generate. The effect of ultrasonic power and thickness of the water layer on the groove section’s micro-cracks is discussed systematically to control the micro-cracks formation and improve the processing quality. The experimental and simulational results indicate the maximum radius of the bubbles and the bubble interference coefficient have an important effect on the micro-cracks formation. The larger the maximum radius of the bubble, the shorter the micro-cracks formed, and the smaller the bubble interference coefficient, it is easier to produce micro-cracks. The bubble interference coefficient and the maximum radius of the bubble can be affected by the water layer thickness and ultrasonic power. Therefore the micro-cracks can be effectively controlled by selecting the appropriate water layer thickness of 1.5mm and ultrasonic power of 195W in this study. The study is obtained from this study provides a guide for micro-cracks under ultrasonic-assisted solution confined laser processing.

在超声波辅助的水密激光微加工硅中，可能会产生微裂纹。系统地讨论了超声功率和水层厚度对沟槽截面微裂纹的影响，以控制微裂纹的形成并提高加工质量。实验和仿真结果表明，气泡的最大半径和气泡干涉系数对微裂纹的形成有重要影响。气泡的最大半径越大，形成的微裂纹越短，并且气泡干涉系数越小，越容易产生微裂纹。气泡干涉系数和气泡的最大半径会受到水层厚度和超声波功率的影响。毫米和195 W的超声功率在这项研究中。这项研究是从这项研究中获得的，为在超声辅助溶液约束激光加工下的微裂纹提供了指南。