The bondability and reliability of Ag–5Pd–3.5Au alloy wire was verified previously for application in light-emitting diode (LED) packages. This Ag-alloy bonding wire has an electrical resistivity of 4.6 $\mu \Omega \cdot $ cm, lower than those of the ternary Ag–3Pd–20Au (8.6 $\mu \Omega \cdot $ cm) and Ag–3Pd–8Au wires (5.0 $\mu \Omega \cdot $ cm). Further evaluation of the resistance of ion migration in Ag-alloy bonding wires using water drop tests indicated that a declining tendency of ion migration rates existed for various binary Ag–Pd and ternary Ag–Pd–Au alloy wires with increases in Pd and Au contents. Among the all Ag-alloy bonding wires in this study, the Ag–5Pd–3.5Au wire exhibited the lowest ion migration rate of 4.87 $\mu \text{m}$ /s. The measurements of anodic dissolution rates were consistent with the tendency of ion migration rates, which were dependent on Pd and Au contents, resulting in the low value of Ag–5Pd–3.5Au alloy wire (0.017 $\mu \text{m}$ /s).

中文翻译：

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优化的Ag-5Pd-3.5Au键合引线可抵抗LED封装中的Ag离子迁移

Ag–5Pd–3.5Au合金线的可焊性和可靠性先前已经过验证，可用于发光二极管（LED）封装。该银合金焊线的电阻率为4.6 $ \ mu \ Omega \ cdot $ cm，低于三元Ag–3Pd–20Au（8.6 $ \ mu \ Omega \ cdot $ 厘米）和Ag–3Pd–8Au导线（5.0 $ \ mu \ Omega \ cdot $ 厘米）。使用水滴测试对银合金焊线中离子迁移电阻的进一步评估表明，随着Pd和Au含量的增加，各种二元Ag-Pd和三元Ag-Pd-Au合金线存在离子迁移率下降的趋势。在这项研究的所有银合金接合线中，Ag-5Pd-3.5Au线的离子迁移率最低，为4.87 $ \ mu \ text {m} $ / s。阳极溶解速率的测量与离子迁移速率的趋势一致，后者取决于Pd和Au含量，导致Ag-5Pd-3.5Au合金线的值较低（0.017 $ \ mu \ text {m} $ / s）。