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The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn–25Sb-xAg high temperature lead-free solder
Vacuum ( IF 4 ) Pub Date : 2020-12-24 , DOI: 10.1016/j.vacuum.2020.110015
Chaojun Li , Yanfu Yan , Tingting Gao , Guodong Xu

Adding Ag to Sn–25Sb solder to prepare Sn–25Sb-xAg (x = 0, 2.5, 3.0 and 3.5, x is the mass percentage) solder alloys. Using optical microscope, JSM-5610LV field emission scanning electron microscope, X-ray diffraction (XRD), differential scanning calorimetry (DSC), Vickers hardness tester and tensile testing machine to test the microstructure of the solder alloy, thermal performance and mechanical performance. The microstructure test results of the solder alloys show that Ag3 (Sn, Sb) intermetallic compounds (IMCs) are formed in the Sn–25Sb-xAg (x = 2.5, 3.0 and 3.5) alloys after Ag is added, and they are dispersed in β-Sn phase. Ag3 (Sn, Sb) IMCs are pinned at the grain boundary of β-Sn and SbSn phases. Moreover, it is also found that the addition of Ag makes the β-Sn and SbSn phases in the Sn–25Sb-xAg (x = 2.5, 3.0 and 3.5) solder alloy refined. DSC analysis results show that the melting point of Sn–25Sb-xAg (x = 0, 2.5, 3.0 and 3.5) solder alloy decreases slightly after adding Ag. Among them, the pasty range of Sn–25Sb-2.5Ag solder alloy is the smallest at 12.84 °C, followed by Sn–25Sb-3.5Ag at 14.81 °C. In the mechanical performance test of the solder alloy, it is found that the ultimate tensile strength (UTS) and elongation of the Sn–25Sb-xAg solder alloy increase with the increase of Ag addition. Sn–25Sb-3.5Ag solder alloy has the highest UTS and elongation, which are 69.25 MPa and 8.02% respectively. The increase is mainly through fine-grain strengthening and dispersion strengthening mechanisms.



中文翻译:

Ag对Sn–25Sb- x Ag高温无铅焊料的微观结构,热性能和机械性能的影响

将银添加到Sn-25Sb焊料中以制备Sn-25Sb- x Ag(x  = 0、2.5、3.0和3.5,x为质量百分比)焊料合金。使用光学显微镜,JSM-5610LV场发射扫描电子显微镜,X射线衍射(XRD),差示扫描量热法(DSC),维氏硬度计和拉伸试验机来测试焊料合金的微观结构,热性能和机械性能。钎料合金的微观结构测试结果表明,在添加Ag之后,Sn–25Sb- x Ag(x  = 2.5、3.0和3.5)合金中形成了Ag 3(Sn,Sb)金属间化合物(IMC)。分散在β-Sn相中 银3(Sn,Sb)IMC固定在β-Sn和SbSn相的晶界处。此外,还发现添加Ag可以使Sn-25Sb- x Ag(x  = 2.5、3.0和3.5)焊料合金中的β-Sn和SbSn相细化。DSC分析结果表明, 添加Ag后,Sn-25Sb- x Ag(x = 0、2.5、3.0和3.5)焊料合金的熔点略有降低。其中,Sn–25Sb-2.5Ag焊料合金的糊状范围在12.84°C时最小,其次是在14.81°C的Sn–25Sb-3.5Ag焊料合金。在焊料合金的机械性能测试中,发现Sn-25Sb- x的极限抗拉强度(UTS)和伸长率Ag焊料合金随着Ag添加量的增加而增加。Sn–25Sb-3.5Ag焊料合金的UTS和伸长率最高,分别为69.25 MPa和8.02%。增加主要是通过细粒强化和弥散强化机制。

更新日期:2020-12-24
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