The incorporation of high dielectric constant filler particles into thermoplastics is an attractive approach to develop materials with high dielectric strength, low dielectric loss, and mechanical stiffness, for electronic packaging purposes. Herein, we report the preparation and properties of polystyrene (PS) based low loss 0–3 composites with inorganic PbZr_0.3Ti_0.7O₃ (PZT) filler particles in concentrations ranging from 0%–20% (w/w). The PZT particles were synthesized using the sol‐gel process and the composites were prepared by a two‐step, solvent‐free approach: (1) melt mixing, followed by (2) hot press. The thermal and mechanical properties of the composite samples were investigated. The dielectric behavior of the as‐synthesized composites showed pronounced improvement over pure PS, as is seen from the increased dielectric constant and extremely low loss tangent. For 20 wt.% PZT loading, the dielectric constant of the composite is as high as 12 at 1 MHz frequency, which is about five times greater than that of pure PS (ε = 2.5). All the PZT/PS composites exhibit remarkably low dielectric losses, even at lower frequencies (tan δ ≤ 0.04), which is better than reported literature values of PS based composites. The variation in dielectric constants of the samples with increasing temperatures was also recorded.

中文翻译：

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热压法制备低损耗PbZr0.3Ti0.7O3 /聚苯乙烯复合材料的热，机械和介电性能

将高介电常数的填料颗粒掺入热塑性塑料中是一种吸引人的方法，可开发出具有高介电强度，低介电损耗和机械刚度的材料，用于电子包装。在本文中，我们报告了浓度为0％至20％（w / w）的无机PbZr _0.3 Ti _0.7 O ₃（PZT）填料颗粒的基于聚苯乙烯（PS）的低损耗0-3复合材料的制备和性能。PZT颗粒是通过溶胶-凝胶法合成的，复合材料是通过两步，无溶剂的方法制备的处理方法：（1）熔融混合，然后（2）热压。研究了复合材料样品的热性能和机械性能。从增加的介电常数和极低的损耗角正切可以看出，合成后的复合材料的介电性能比纯PS有了明显改善。对于20 wt。％的PZT负载，复合材料的介电常数在1 MHz频率下高达12，约为纯PS的介电常数（ε= 2.5）的五倍。即使在较低的频率（tanδ≤0.04）下，所有PZT / PS复合材料也表现出极低的介电损耗，这比PS基复合材料的文献报道值要好。还记录了样品的介电常数随温度升高的变化。