This Special Issue is dedicated to recent research in the field of compact modeling of semiconductor devices. This is the first J-EDS Special Issue on compact modeling. In the last years, a number of new semiconductor device structures, for electronic and photonic applications, have been developed. Compact models are needed for the incorporation of these new devices in integrated circuits. Therefore, a Special Issue was needed to present recent compact modeling solutions for semiconductor devices

中文翻译：

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半导体器件紧凑建模的前言特刊

本期专刊致力于半导体器件紧凑建模领域的最新研究。这是有关紧凑建模的第一个J-EDS特刊。在过去的几年中，已经开发出了许多用于电子和光子应用的新型半导体器件结构。需要紧凑的模型才能将这些新设备集成到集成电路中。因此，需要有一个特刊来介绍半导体器件的最新紧凑建模解决方案