Embedded components are one of the current trends in electronics, allowing to produce more compact devices with increased functionality. Such components can be applied, among others, in fabrication devices used in the Internet‐of‐Things technology or in special industries. Therefore, their reliability plays a key role due to safety requirements and high deployment costs. Herein, the thermal reliability of a system of sensors embedded into a printed circuit board (PCB) is examined. The samples produced are exposed to temperature cycling, −40 °C/+105 °C, or high temperature/high humidity, 85 °C/85% relative humidity (RH). The quality of solder joints is evaluated on the basis of X‐ray inspection and cross sections before and after the exposure mentioned earlier. The tests show no damage to the solder joints of the samples subjected to reliability testing in high‐temperature/high‐humidity conditions, irrespective of the solder alloy used. Cracks appear after 500 cycles, −40 °C/+105 °C, in samples soldered with Sn99Cu1 and after 1000 temperature cycles in both Sn99Cu1 and LFM‐48S (SnAg3.0Cu0.5) solders. The presented results are used for efficient embedding of electronic components into PCBs. Consequently, more space is gained for other components and the size of the electronic products is minimized.

中文翻译：

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嵌入印刷电路板的传感器系统的可靠性调查

嵌入式组件是电子产品当前的趋势之一，可以生产功能更强大的更紧凑的设备。此类组件尤其可以应用于物联网技术或特殊行业中使用的制造设备中。因此，由于安全要求和高昂的部署成本，其可靠性起着关键作用。在此，检查了嵌入印刷电路板（PCB）中的传感器系统的热可靠性。将产生的样品暴露于−40°C / + 105°C的温度循环下，或暴露于85°C / 85％相对湿度（RH）的高温/高湿度下。焊点的质量根据X射线检查和上述暴露前后的横截面进行评估。测试表明，在高温/高湿条件下进行可靠性测试的样品的焊点均不受损坏，而与所使用的焊料合金无关。在用Sn99Cu1焊接的样品中，在500个循环（−40°C / + 105°C）之后，以及在1000个温度循环后，在Sn99Cu1和LFM-48S（SnAg3.0Cu0.5）焊料中出现裂纹。呈现的结果用于将电子组件有效地嵌入到PCB中。因此，可为其他组件获得更多空间，并使电子产品的尺寸最小化。呈现的结果用于将电子组件有效地嵌入到PCB中。因此，可为其他组件获得更多空间，并使电子产品的尺寸最小化。呈现的结果用于将电子组件有效地嵌入到PCB中。因此，可为其他组件获得更多空间，并使电子产品的尺寸最小化。