Tandon–Weng model based on Mori–Tanaka idea for tensile modulus of conventional composites is currently used for various polymer nanocomposites, but some complex terms in this model may limit the calculations. In this article, this model is simplified and developed for ternary polymer nanocomposites containing layered and spherical nanofillers. The calculations of developed model are compared with the experimental results and the trends between experimental data and the predictions are explained. The developed model shows that some parameters such as tensile modulus of nanoparticles cannot significantly affect the tensile modulus of binary and ternary nanocomposites, due to its very high level.

中文翻译：

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三元聚合物纳米复合材料拉伸模量的 Tandon-Weng 模型的简化和发展：预测与实验结果的比较

基于 Mori-Tanaka 传统复合材料拉伸模量思想的 Tandon-Weng 模型目前用于各种聚合物纳米复合材料，但该模型中的一些复杂项可能会限制计算。在本文中，该模型针对包含层状和球形纳米填料的三元聚合物纳米复合材料进行了简化和开发。将开发模型的计算与实验结果进行比较，并解释实验数据与预测之间的趋势。开发的模型表明，纳米粒子的拉伸模量等一些参数不会显着影响二元和三元纳米复合材料的拉伸模量，因为它的水平非常高。