Abstract In order to enhance the oxidation resistance of a copper substrate, silver films were deposited by three-times electroless plating onto pure copper powders. Silver-coated copper (Ag/Cu) powders were introduced into electrically conductive adhesives (ECAs) as conductive fillers. The electrical conductivity of the ECAs can be increased by the inclusion of conductive fillers into the insulating resin matrix. The structures of the Ag/Cu powders and ECAs were characterized by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. The morphology investigation showed that the silver coatings were compact and continuous. It was found that the ECAs can be solidified through chemical sintering in air at 150 °C for 30min. The minimum volume resistivity was shown to reach 2 × 10 - 4 Ω • cm , suggesting excellent electrical conductivity, which makes us believe that the silver films have excellent oxidation resistance and could be broadly applied in the preparation of ECAs.

中文翻译：

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由环氧树脂和镀银铜粉制成的导电粘合剂在烧结和热老化后的电性能

摘要 为了提高铜基材的抗氧化性，在纯铜粉上采用3次化学镀方法沉积银膜。将镀银铜 (Ag/Cu) 粉末作为导电填料引入导电粘合剂 (ECA)。ECA 的导电性可以通过将导电填料包含在绝缘树脂基质中来增加。Ag/Cu 粉末和 ECA 的结构分别通过扫描电子显微镜 (SEM) 和能谱仪 (EDS) 进行表征。形貌研究表明银涂层致密且连续。发现 ECA 可以通过在空气中在 150°C 下化学烧结 30 分钟而固化。最小体积电阻率达到 2 × 10 - 4 Ω • cm ，