Low thermal conductivity (TC) and poor flame retardancy of graphene oxide (GO) have limited its application in thermal management. Herein, a facile strategy is developed to fabricate flexible and free-standing graphene/MXene (GM) films by filtration of MXene and GO dispersions, followed by reduction and thermal welding. As results, interlamellar insertion of MXene into graphene has occurred and optimized interface was constructed between MXene and graphene. According to Y. Agari’s semi-empirical model and modified Maxwell-Garnett effective medium approximation, demonstrating that an optimized interface between MXene and graphene is conducive to heat conduction, and reduces the interface scattering. In-plane TC thus reached to 26.49 Wm⁻¹K⁻¹, and the thermal boundary resistance decreased to 8.81 × 10⁻¹⁰ from 1.54 × 10⁻⁸ m²KW⁻¹. GM films also present excellent flame retardancy (peak heat release is ~10 Wg⁻¹) and it still maintained initial shape after combustion. Using as-prepared GM films as heat dissipation, we demonstrate its potential usefulness in electronic device-cooling applications.

低导热系数（TC）和差的氧化石墨烯（GO）阻燃性限制了其在热管理中的应用。本文中，开发了一种容易的策略，以通过过滤MXene和GO分散体，然后进行还原和热焊接来制造柔性且独立的石墨烯/ MXene（GM）膜。结果，发生了MXene向石墨烯的层间插入，并且在MXene和石墨烯之间构建了优化的界面。根据Y. Agari的半经验模型和改进的Maxwell-Garnett有效介质近似，证明MXene和石墨烯之间的优化界面有助于导热，并减少了界面散射。面内TC因此达到26.49 Wm ^-1 K ^-1，热边界电阻从1.54×10 ^-8 m ² KW ^-1降至8.81×10 ^-10。GM薄膜还具有出色的阻燃性（峰值放热约为10 Wg ^-1），并且在燃烧后仍保持初始形状。使用准备好的GM薄膜作为散热材料，我们证明了其在电子设备冷却应用中的潜在用途。