To meet the urgent requirement of high heat flux cooling of the chips in current electronic equipment, a unique and reliable U-shaped heat pipe bonded heat sink was developed and experimentally investigated for CPU cooling in computers. This novel heat sink was bonded with air-cooled fin stacks and two U-shaped heat pipes through the base plate. In this work, the effects of relevant parameters, including orientation of the heat sink, working conditions (air velocity and ambient temperature) of the computer on the variation of CPU temperature and overall thermal resistance of the heat sink are considered. The tests indicate that the overall thermal resistance of the heat sink at orientation α = 90° is lower than that in another five orientation cases, and reaches the minimum value of 0.263 ℃/W. If the operating temperature of the CPU is limited to below 70 ℃, the maximum heat dissipation power of the heat sink reaches 130 W. It can be seen that the orientation and working conditions of the heat sink have significant effects on the cooling capacity which results in variation in the overall thermal resistance of the heat sink. In addition, the comparison of overall thermal resistance between the novel heat sink and a traditional CPU fin-bonded heat sink indicates that the novel heat sink provides greater reliability.

为了满足当前电子设备中芯片的高热通量冷却的迫切需求，开发了一种独特且可靠的U形热管粘结散热器，并通过实验研究了计算机中CPU的冷却情况。该新型散热器与风冷翅片叠层和穿过底板的两个U形热管结合在一起。在这项工作中，考虑了相关参数（包括散热器的方向，计算机的工作条件（风速和环境温度））对CPU温度和散热器整体热阻变化的影响。测试表明，散热器在方向α 处的整体热阻= 90°低于其他五个定向情况下的90°，并达到0.263℃/ W的最小值。如果将CPU的工作温度限制在70℃以下，则散热器的最大散热功率将达到130W。可以看出，散热器的方向和工作条件会对冷却能力产生重大影响，从而导致散热器整体热阻的变化。此外，新型散热器与传统CPU鳍片式散热器之间的整体热阻比较表明，新型散热器具有更高的可靠性。