Abstract The goal of the present work is to identify and model the elastic-viscoplastic behavior of electrodeposited copper films under tension-compression loadings. From the experimental point of view, as proposed in the literature, a film of copper is electrodeposited on both sides of an elastic compliant substrate. The overall specimen is next subjected to tensile loading-unloadings. As the substrate remains elastic, the elastic–plastic response of copper under cyclic loading is experimentally determined. A clear kinematic hardening behavior is captured. To model the mechanical response, a new elastic-viscoplastic self-consistent scheme for polycrystalline materials is proposed. The core of the model is the tangent additive interaction law proposed in Molinari (2002). The behavior of the single grain is rate dependent where kinematic hardening is accounted for in the model at the level of the slip system. The model parameters are optimized via an evolutionary algorithm by comparing the predictions to the experimental cyclic response. As a result, the overall response is predicted. In addition, the heterogeneity in plastic strain activity is estimated by the model during cyclic loading.

中文翻译：

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电沉积铜膜的循环响应。实验和弹性粘塑性平均场建模。

摘要 目前工作的目标是确定和模拟电沉积铜膜在拉压载荷下的弹粘塑性行为。从实验的角度来看，正如文献中所提出的，在弹性柔顺基材的两侧电沉积铜膜。接下来对整个试样进行拉伸加载-卸载。由于基材保持弹性，铜在循环载荷下的弹塑性响应是通过实验确定的。捕捉到清晰的运动硬化行为。为了模拟机械响应，提出了一种用于多晶材料的新的弹-粘塑性自洽方案。该模型的核心是 Molinari (2002) 提出的切线加性相互作用定律。单晶粒的行为取决于速率，其中在滑移系统级别的模型中考虑了运动硬化。通过将预测与实验循环响应进行比较，通过进化算法优化模型参数。结果，预测了总体响应。此外，塑性应变活动的异质性由循环加载期间的模型估计。