Abstract

The kinetic regularities are considered of etching thin films of lead sulfide in solutions containing hydrochloric acid, hydrogen peroxide, and glycerol under conditions of varying concentrations of the initial components and the etching temperature. The partial orders of the reaction were calculated: for hydrochloric acid the value was 2.8, for hydrogen peroxide, 0.2, and for glycerol, 0.5. The activation energy of the lead sulfide etching process was 48.1 kJ mol^–1.

中文翻译：

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在含过氧化氢和甘油的盐酸溶液中蚀刻硫化铅薄膜的动力学规律

摘要

在改变初始成分浓度和蚀刻温度的条件下，考虑在含有盐酸，过氧化氢和甘油的溶液中蚀刻硫化铅薄膜的动力学规律。计算反应的部分顺序：对于盐酸，该值为2.8，对于过氧化氢为0.2，对于甘油为0.5。硫化铅蚀刻工艺的活化能为48.1 kJ mol ^–1。