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Unclad Microphotonics for Terahertz Waveguides and Systems
Journal of Lightwave Technology ( IF 4.7 ) Pub Date : 2020-01-01 , DOI: 10.1109/jlt.2020.3021681
Daniel Headland , Withawat Withayachumnankul , Xiongbin Yu , Masayuki Fujita , Tadao Nagatsuma

A practical approach to realize substrateless, unclad, micro-scale intrinsic silicon waveguides for the terahertz range is presented. The waveguides are monolithically integrated within a supporting silicon frame, with which they are fabricated together from the same silicon wafer in a single-mask etching process. This establishes an integration platform to house many diverse components and facilitates packaging. Effective medium techniques are deployed to prevent the frame from interfering with the waveguide's functionality. Straight waveguides of this sort are experimentally found to be efficient and broadband. Elementary components including Y-junctions and evanescent couplers are developed, and deployed in demonstrations of applications for terahertz waves including sensing and communications. This is a promising pathway to realize future microphotonic devices for diverse applications of terahertz waves.

中文翻译:

用于太赫兹波导和系统的无包层微光子学

提出了一种实用的方法来实现太赫兹范围内的无基板、无包层、微型本征硅波导。波导被单片集成在支撑硅框架内,它们在单掩模蚀刻工艺中由相同的硅晶片制成。这建立了一个集成平台来容纳许多不同的组件并促进包装。部署了有效的介质技术以防止框架干扰波导的功能。实验发现,这种直波导是高效且宽带的。开发了包括 Y 结和渐逝耦合器在内的基本组件,并部署在太赫兹波的应用演示中,包括传感和通信。
更新日期:2020-01-01
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