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Evaluation of enamel loss by scanning electron microscopy after debonding brackets place with four different adhesives
Microscopy Research and Technique ( IF 2.5 ) Pub Date : 2020-11-26 , DOI: 10.1002/jemt.23652
Jacqueline Adelina Rodríguez-Chávez 1 , Jesús Ángel Arenas-Alatorre 2 , Hugo M Flores-Ruiz 3 , Abigailt Flores-Ledesma 4 , Fernando Javier Aguilar-Pérez 5
Affiliation  

The clinically adequate shear bond strengths (SBS) should be from 2.8 to 10 MPa. The aim of this research is to observe tooth enamel loss through a scanning electron microscope (SEM) during the debonding of braces of four adhesive systems. Then, 100 premolars were used in 4 groups of 25 specimens each, for Transbond MIP (G1), Enlight (G2), Stylus (G3), and Transbond Plus SEP (G4). The research was done under the NOM ISO/TS 11405:2015. Gemini 3M were placed under the manufacturer's recommendations. The SBS test was done at 24 hr in an Instron electromechanical universal testing machine at 1 mm/1 min. Adhesive remnant index (ARI) was measured, all of the brackets where examined in the SEM. For the shear bonding strength G1 = 10.09 ± 2.73 MPa, G2 = 9.27 ± 3.99 MPa, G3 = 7.83 ± 4.46 MPa, and G4 = 6.40 ± 2.85 MPa statistically significant differences were found when comparing the four groups (p = .002). In the Tukey post hoc test, G1 versus G4 and G2 versus G4, statistically significant differences were found. For the ARI a value of 1 in 46%, followed by a value of 2 in 38%, a value of 3 in 13% and a value of 0 in 3% of the total samples, finding statistically significant differences (p < .001). In relation to the tooth enamel loss due to SBS, statistically significant differences were found (p = .326). G1 and G4 had not statistically significant differences. Even though our results concur with the appropriate clinical values, we observed tooth enamel loss with Transbond Plus SEP and Stylus.

中文翻译:

用四种不同的粘合剂剥离托槽后,通过扫描电子显微镜评估釉质损失

临床上足够的剪切粘合强度 (SBS) 应为 2.8 至 10 MPa。本研究的目的是通过扫描电子显微镜 (SEM) 观察四种粘合剂系统的牙套脱粘过程中牙釉质的损失。然后,将 100 颗前磨牙分为 4 组,每组 25 个样本,分别用于 Transbond MIP (G1)、Enlight (G2)、Stylus (G3) 和 Transbond Plus SEP (G4)。该研究是在 NOM ISO/TS 11405:2015 下完成的。Gemini 3M 被置于制造商的建议之下。SBS 测试在 Instron 机电万能试验机中以 1 毫米/1 分钟的速度在 24 小时后进行。测量残胶指数 (ARI),所有支架均在 SEM 中检查。对于剪切粘合强度 G1 = 10.09 ± 2.73 MPa,G2 = 9.27 ± 3.99 MPa,G3 = 7.83 ± 4.46 MPa,G4 = 6.40 ± 2。p = .002)。在 Tukey事后检验中,G1 与 G4 和 G2 与 G4,发现统计学上的显着差异。对于 ARI,在 46% 中的值为 1,在 38% 中为 2,在 13% 中为 3,在 3% 中为 0,发现统计显着差异(p < .001 )。关于 SBS 引起的牙釉质损失,发现具有统计学意义的差异 ( p = .326)。G1和G4在统计学上没有显着差异。尽管我们的结果与适当的临床值一致,但我们还是观察到 Transbond Plus SEP 和 Stylus 的牙釉质脱落。
更新日期:2020-11-26
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