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Modal effective electromechanical coupling coefficient of shear-mode piezoceramic sandwich cantilevers with segmented multicore: Experimental and numerical assessments
Journal of Vibration and Control ( IF 2.8 ) Pub Date : 2020-11-25 , DOI: 10.1177/1077546320972908
Pelin Berik 1 , Ayech Benjeddou 2, 3
Affiliation  

Smart sandwich cantilevers with aluminum faces and single and double cores, formed by assembled shear-mode piezoceramic patches with same poling, are experimentally and numerically assessed for the first time. To measure the electromechanical coupling efficiency of such vibrating smart structures, the so-called modal effective electromechanical coupling coefficient is used as a performance indicator. Hence, it is first experimentally analyzed under different electric connections (short circuit, open circuit, series wiring, and parallel wiring) of the patches’ electrodes; then, it is numerically investigated for models with different refinements (equipotential constraints and bonding adhesives) using ABAQUS® three-dimensional finite element simulations. It is found that the experimental modal effective electromechanical coupling coefficient is low for the smart shear-mode piezoceramic single core sandwich but can be increased using multilayer designs, as confirmed by the smart shear-mode piezoceramic double core sandwich. Numerically, it is found that the electric connection has less influence on the modal effective electromechanical coupling coefficient evaluation than the equipotential constraints and adhesives modeling, in particular for the smart shear double core sandwich. The proposed two benchmarks can be used by the research community of smart structures, systems, and devices for validating new shear-mode response-based theories and numerical models or designing related engineering applications, such as shunted damping, energy harvesting, structural health monitoring, resonators, and filters.



中文翻译:

分段多芯剪切模式压电陶瓷夹层悬臂的模态有效机电耦合系数:实验和数值评估

首次通过实验和数值评估了具有铝面,单芯和双芯的智能三明治悬臂,它们是由组装的剪切模式压电陶瓷贴片以相同的极化方式形成的。为了测量这种振动智能结构的机电耦合效率,将所谓的模态有效机电耦合系数用作性能指标。因此,首先要在贴片电极的不同电连接(短路,开路,串联布线和并联布线)下进行实验分析;然后,它被数值研究用于使用ABAQUS具有不同精炼模型(等电位约束和粘合的粘合剂)®三维有限元模拟。发现智能剪切模式压电陶瓷单芯夹层的实验模态有效机电耦合系数低,但是可以通过多层设计来增加,如智能剪切模式压电陶瓷双芯夹层所证实的。从数字上发现,电连接对模态有效机电耦合系数评估的影响要小于等电位约束和粘合剂建模,尤其是对于智能剪切双芯三明治而言。拟议的两个基准可被智能结构,系统和设备的研究团体用来验证基于新的基于剪切模式响应的理论和数值模型或设计相关的工程应用,例如分流阻尼,能量收集,

更新日期:2020-11-25
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