Magnetron sputtering developed rapidly in the 1980s for semiconductor, hard coating, and architectural glass applications. While the general operating principles were well known, subtle issues relating to cathode material, operating parameters, and deposition processes were only empirically understood. A sequence of magnetron measurements is described, which helps develop a more general understanding. The plasma is mostly conventional but is strongly perturbed by the large fluxes of energetic, neutral atoms sputtered from the cathode, which alter the gas dynamics as well as the discharge impedance. These studies have led to practical innovations, such as collimation and ionization of the sputtered atoms, which have been widely used for semiconductor manufacturing applications.

中文翻译：

---

磁控溅射

磁控溅射在1980年代迅速发展，用于半导体，硬涂层和建筑玻璃应用。虽然一般的工作原理是众所周知的，但是与阴极材料，工作参数和沉积过程有关的细微问题只是凭经验理解的。描述了一系列的磁控管测量，有助于形成更一般的理解。等离子体通常是常规的，但是会受到从阴极溅射出的大量高能中性原子的强烈干扰，这会改变气体动力学以及放电阻抗。这些研究导致了实际创新，例如溅射原子的准直和电离，这些创新已被广泛用于半导体制造应用。