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IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2020-11-18 , DOI: 10.1109/tcpmt.2020.3034779


Presents a listing of the editorial board, board of governors, current staff, committee members, and/or society editors for this issue of the publication.

中文翻译:

IEEE组件,包装和制造技术交易出版物信息

提供本期出版物的编辑委员会,理事会,现任工作人员,委员会成员和/或协会编辑的列表。
更新日期:2020-11-21
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