This article presents an overview of testing methods applied to flexible hybrid electronics (FHE). It starts by briefly summarizing and discussing the main properties of substrates, chips, and materials commonly used for flip-chip bonding of FHE. It also describes general accelerated testing methods and how they are related to the current progress in FHE testing. Stressors, such as temperature cycling, temperature/humidity, bending, stretching, and torsion, have been commonly applied to FHE. The application of those stressors and the corresponding failure modes, mechanisms, and factors that impact reliability is summarized and discussed. Methods for testing the reliability of FHE devices, such as radio frequency identification (RFID) tags, have been developed, but there are no industry-wide standards yet to address all aspects of this emerging technology.

中文翻译：

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柔性混合电子系统可靠性测试方法综述

本文概述了应用于柔性混合电子产品（FHE）的测试方法。首先简要概述和讨论通常用于FHE倒装芯片键合的基板，芯片和材料的主要特性。它还描述了常规的加速测试方法，以及它们与FHE测试当前进展的关系。温度循环，温度/湿度，弯曲，拉伸和扭转等应力源已普遍应用于FHE。总结并讨论了这些压力源的应用以及影响可靠性的相应故障模式，机制和因素。已经开发出测试FHE设备可靠性的方法，例如射频识别（RFID）标签，