Abstract Recently, 3D-printed polyether-ether-ketone (PEEK) components have been shown to offer many applications in state-of-the-art electronics, 5G wireless communications, medical implantations, and aerospace components. Nevertheless, a critical barrier that limits the application of 3D printed PEEK components is their weak interfacial bonding strength. Herein, we propose a novel method to improve this unsatisfied situation via the interface plasticizing effect of benzene derivatives obtained from the thermal pyrolysis of trisilanolphenyl polyhedral oligomeric silsequioxane (POSS). Based on this method, the bonding strength of the filaments and interlayers of 3D-printed POSS/PEEK components can reach 82.9 MPa and 59.8 MPa, respectively. Moreover, the enhancing mechanism of the pyrolysis products derived from the POSS is characterized using pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS), Fourier transform infrared spectroscopy (FTIR), and X-ray computed tomography (X-CT). Our proposed strategy broadens the novel design space for developing additional 3D-printed materials with satisfactory interfacial bonding strength.

中文翻译：

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通过热解反应 3D 打印高界面键合聚醚醚酮组分

摘要 最近，3D 打印的聚醚醚酮 (PEEK) 组件已被证明可以在最先进的电子产品、5G 无线通信、医疗植入和航空航天组件中提供许多应用。然而，限制 3D 打印 PEEK 组件应用的一个关键障碍是其较弱的界面结合强度。在此，我们提出了一种新方法，通过从三硅烷醇苯基多面体低聚倍半硅氧烷 (POSS) 热解获得的苯衍生物的界面增塑作用来改善这种不满意的情况。基于这种方法，3D打印的POSS/PEEK组件的细丝和夹层的结合强度分别可以达到82.9 MPa和59.8 MPa。而且，使用热解-气相色谱/质谱 (Py-GC/MS)、傅里叶变换红外光谱 (FTIR) 和 X 射线计算机断层扫描 (X-CT) 表征源自 POSS 的热解产物的增强机制。我们提出的策略拓宽了新的设计空间，用于开发具有令人满意的界面结合强度的其他 3D 打印材料。