In this paper, a fluid line-jet polishing (FLJP) process was developed for the polishing of rotational axisymmetric surface (RAS). FLJP aims to enhance the polishing efficiency of fluid jet polishing without degrading the polished surface integrity, together with better material removal uniformity than linear-array multi-jet polishing (MJP). The fluid field was analyzed by comparing to the normal fluid jet polishing (FJP) based on computational fluid dynamics (CFD) method so as to test the stability of the fluid line-jet. A series of polishing experiments were conducted to analyze the performance of the FLJP and compared to FJP and MJP in terms of material removal characteristics, the effect of the main factors (i.e. fluid pressure, stand-off distance, etc.), material removal uniformity and surface quality after polishing on cylindrical surfaces. The results indicate that FLJP has much higher material removal rate than FJP under the same polishing conditions together with superior surface quality. The material removal after FLJP is much more uniform than MJP, especially at the region along the length direction of the line orifice. Moreover, it is also found that the relationship between the polishing factors and the material removal rate in FLJP is similar to FJP, resulting in good control of material removal.

本文针对旋转轴对称表面（RAS）的抛光开发了流体线喷射抛光（FLJP）工艺。FLJP旨在提高流体喷射抛光的抛光效率，而不会降低抛光表面的完整性，并且与线性阵列多喷射抛光（MJP）相比，具有更好的材料去除均匀性。通过与基于计算流体动力学（CFD）方法的常规流体射流抛光（FJP）进行比较来分析流场，以测试流体管线射流的稳定性。进行了一系列抛光实验以分析FLJP的性能，并在材料去除特性，主要因素（即流体压力，支座距离等）的影响，材料去除均匀性方面与FJP和MJP进行了比较。圆柱表面抛光后的表面质量。结果表明，在相同的抛光条件下，FLJP的材料去除率比FJP高得多，并且表面质量更好。FLJP之后的材料去除比MJP更均匀，尤其是在沿线孔长度方向的区域。此外，还发现FLJP中的抛光因子与材料去除速率之间的关系类似于FJP，从而导致对材料去除的良好控制。