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Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-11-16 , DOI: 10.1108/ssmt-06-2020-0028 Buen Zhang , Noor H. Jabarullah , Ayad F. Alkaim , Svetlana Danshina , Irina V. Krasnopevtseva , Yuan Zheng , Nisith Geetha
中文翻译:
使用基于能量的新型模型对功率半导体中焊点的热机械疲劳寿命进行评估
更新日期:2020-11-16
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-11-16 , DOI: 10.1108/ssmt-06-2020-0028 Buen Zhang , Noor H. Jabarullah , Ayad F. Alkaim , Svetlana Danshina , Irina V. Krasnopevtseva , Yuan Zheng , Nisith Geetha
Purpose
This paper aims to establish a more accurate model for lifetime estimation.
Design/methodology/approach
Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.
Findings
A more precise model was found.
Originality/value
It is confirmed that the paper is original.
中文翻译:
使用基于能量的新型模型对功率半导体中焊点的热机械疲劳寿命进行评估
目的
本文旨在建立一个更准确的寿命估计模型。
设计/方法/方法
有限元模型仿真和实验测试用于增强焊点的寿命预测模型。
发现
找到了更精确的模型。
创意/价值
确认纸张是原件。