Information and communication technology (ICT) has been critical to the emergence of a new Internet-of-Things (IoT) era, as a rapidly increasing number and variety of IoT electronic devices in a wide range of end-use sectors require massive data communication in terms of volume, velocity/speed, and variety. Semiconductor technology advancements have played a key role in ICT and unlike the past ICT energy footprint analysis, which focused on the final electronic product, an attempt has been made to examine the global energy impacts for the period 2016–2025 based on the market forecasts of three major IoT IC types, i.e., sensors and actuators, connectivity, and processor ICs distributed among four major IoT device components.

Total global IoT semiconductor primary energy demand is projected to increase from 2 EJ in 2016 to 35 EJ by 2025, resulting mainly from a substantial projected increase energy needed in the manufacturing of ICs, with growth in the use of sensors and energy-intensive next fab generation manufacturing. Unlike the trend in manufacturing energy, total global operational energy use is projected to decrease significantly with the development of smaller transistor size, low-power devices, and faster wireless data communication technology. Total operational energy is projected to significantly decrease from 118 TWh/year (1,2 EJ/year) to less than 1 TWh/year (0.003 EJ/year) in spite of a significantly higher anticipated growth in its market size during the 2016–2025 forecast period. Its annual share of total primary energy use is projected to reach an insignificant level of 0.01% by the end of 2025, consistent with the past limited electronic product life cycle analyses besides the analysis focus here limited to ICs in IoT devices.

信息通信技术（ICT）对于新的物联网（IoT）时代的出现至关重要，因为在众多最终用途部门中，数量迅速增长的IoT电子设备种类繁多，需要进行大规模的数据通信就体积，速度/速度和种类而言。半导体技术的进步在ICT中起着关键作用，与以往的ICT能源足迹分析（以最终电子产品为重点）不同，它已经尝试根据市场预测对2016-2025年期间的全球能源影响进行研究。三种主要的IoT IC类型，即分布在四个主要IoT设备组件之间的传感器和执行器，连接性和处理器IC。

全球物联网半导体一次能源总需求预计将从2016年的2 EJ增长到2025年的35 EJ，这主要是由于IC制造所需的大量能源需求增加，以及传感器和高耗能的下一个晶圆厂的需求增长代制造。与制造能源的趋势不同，随着较小的晶体管尺寸，低功耗设备和更快的无线数据通信技术的发展，预计全球总运行能源使用量将大大减少。尽管2016-2016年市场规模的预期增长显着更高，但总运营能源预计将从118 TWh /年（1,2 EJ /年）显着减少至不到1 TWh /年（0.003 EJ /年）。 2025年预测期。