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An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-11-11 , DOI: 10.1108/ssmt-07-2020-0031 Feng Wang , Fangfang Zhang , Qixiang Huang , Mohammad Salmani
中文翻译:
电子系统中焊点机械随机振动疲劳损伤的研究
更新日期:2020-11-11
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-11-11 , DOI: 10.1108/ssmt-07-2020-0031 Feng Wang , Fangfang Zhang , Qixiang Huang , Mohammad Salmani
Purpose
The purpose of this paper is to propose a method with capability of short-time implementation.
Design/methodology/approach
This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.
Findings
A new method with good agreement with experimental tests has been proposed.
Originality/value
It is confirmed that paper is original.
中文翻译:
电子系统中焊点机械随机振动疲劳损伤的研究
目的
本文的目的是提出一种具有短时执行能力的方法。
设计/方法/方法
本文通过实验测试和仿真来指导,提出了一种用于评估焊点寿命的综合方法。
发现
提出了一种与实验测试吻合良好的新方法。
创意/价值
确认纸张是原件。