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An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-11-11 , DOI: 10.1108/ssmt-07-2020-0031
Feng Wang , Fangfang Zhang , Qixiang Huang , Mohammad Salmani

Purpose

The purpose of this paper is to propose a method with capability of short-time implementation.

Design/methodology/approach

This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.

Findings

A new method with good agreement with experimental tests has been proposed.

Originality/value

It is confirmed that paper is original.



中文翻译:

电子系统中焊点机械随机振动疲劳损伤的研究

目的

本文的目的是提出一种具有短时执行能力的方法。

设计/方法/方法

本文通过实验测试和仿真来指导,提出了一种用于评估焊点寿命的综合方法。

发现

提出了一种与实验测试吻合良好的新方法。

创意/价值

确认纸张是原件。

更新日期:2020-11-11
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