With the revolutionary developments in the fields of millimeter-wave (mm-wave) and Internet of Things (IoT) technologies and the billion devices promised to be implemented by the end of the decade, the realization of inexpensive, low-power, and intelligent systems is highly desirable. Additive manufacturing (AM) is a technology seeing widespread adoption due to its ability to enable rapid prototyping for iterative design; its reduced setup costs, facilitating economic small-batch production; and its ability to significantly reduce waste by-products, resulting in both environmental benefits as well as lower manufacturing costs. On the other hand, current lithography-based manufacturing technologies-a huge contributor to the growing RF and 5G wireless electronics industry-require extensive design verification, have longer turnaround times, and produce harmful byproducts. Although AM can offer time and cost benefits under the correct conditions, among the more impactful demonstrations of the manufacturing technology are the novel topologies enabled by design rules that allow feature sets, including nonorthogonal planes, conformal surfaces, multimaterial deposition, simultaneous thick- and thin-film deposition [1], complex 3D structures, integrated voids, and gradient index materials.

中文翻译：

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Inkjet-/3D-/4D-Printed Perpetual Electronics and Modules：用于 5G+、物联网、智慧农业和智慧城市应用的射频和毫米波设备

随着毫米波 (mm-wave) 和物联网 (IoT) 技术领域的革命性发展以及有望在 10 年底实现的 10 亿台设备，实现廉价、低功耗、智能系统是非常可取的。增材制造 (AM) 是一项被广泛采用的技术，因为它能够为迭代设计实现快速原型制作；降低设置成本，促进经济的小批量生产；以及显着减少副产品废物的能力，从而带来环境效益和降低制造成本。另一方面，当前基于光刻的制造技术——对不断增长的 RF 和 5G 无线电子行业的巨大贡献——需要广泛的设计验证，具有更长的周转时间，并产生有害的副产品。虽然 AM 可以在正确的条件下提供时间和成本优势，但在制造技术的更具影响力的演示中，设计规则支持的新型拓扑允许特征集，包括非正交平面、共形表面、多材料沉积、同时厚薄-薄膜沉积 [1]、复杂的 3D 结构、集成空隙和梯度指数材料。