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Multiband and Broadband Interference-Free Metallic Package Designs for Microwave Modules
IEEE Microwave and Wireless Components Letters ( IF 3 ) Pub Date : 2020-11-01 , DOI: 10.1109/lmwc.2020.3024772
Muhammet Hilmi Nisanci , Francesco de Paulis

This letter presents a technique for designing metallic packages and cavities hosting RF and/or digital electronic systems for minimizing the unintentional coupling due to cavity resonances. The method involves an appropriate design of the conductive lid by adding periodic structures, unit cells (UCs), characterized by metal pins of appropriate length. The technique proposed herein, based on a quick analytical design procedure, demonstrates that the use of two different UCs arranged by following specific layouts is able to offer either multiple bandgaps or an ultrawide bandgap. Three UCs geometry are analyzed for bandgaps at $X$ -, Ku-, and $K$ -bands; they are combined to achieve the two above-mentioned bandgap responses aimed at $X$ Ku and $X$ $K$ band applications. Both full-wave simulations and experimental results confirm the validity of the proposed technique.

中文翻译:

用于微波模块的多频带和宽带无干扰金属封装设计

这封信介绍了一种设计金属封装和腔体的技术,该腔体承载 RF 和/或数字电子系统,以最大限度地减少由于腔体谐振引起的无意耦合。该方法涉及通过添加周期性结构、单位单元 (UC) 来适当设计导电盖,单位单元 (UC) 以适当长度的金属销为特征。本文提出的技术基于快速分析设计程序,表明使用按照特定布局排列的两个不同 UC 能够提供多个带隙或超宽带隙。分析了三个 UC 几何形状的带隙 $X$ -, -, 和 $K$ -带;它们结合起来以实现上述两个带隙响应,旨在 $X$ —— $X$ —— $K$ 带应用。全波模拟和实验结果都证实了所提出技术的有效性。
更新日期:2020-11-01
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