Abstract Soft and flexible microelectrodes are fabricated and patterned in a novel approach integrating supersonic cluster beam deposition (SCBD) of gold nanoparticles onto Polydimethylsiloxane (PDMS) followed by femtosecond (fs) laser processing. SCBD of gold nanoparticles in PDMS forms a nanocomposite film with mechanical properties similar to those of the elastomeric substrate. Electrically neutral metallic nanoparticles penetrate the polymeric matrix and distribute randomly up to a depth of a few hundred nanometers forming a path of ohmic conduction. High resolution patterning on soft substrates is a major challenge that was overcome by femtosecond laser ablation of micrometer lines with relatively very little thermal damage. Microelectrodes were fabricated with a width down to 3 μm. The printed metal line sheet resistance was 480 Ohm/square for the 100 nm thick film and 210 Ohm/square for the 200 nm thick film. The calculated average film specific resistivity was found to be 2.5–2.6mΩ·cm. It is ~3 orders of magnitude higher than that of physical vapor deposited gold; therefore, it is not suitable for high current interconnects but sufficient for low-current signal transmission such as for electrical and electrochemical biosensors.

中文翻译：

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超音速簇束沉积和飞秒激光加工制备柔软灵活的金微电极

摘要 软而灵活的微电极是用一种新的方法制造和图案化的，将金纳米粒子的超音速簇束沉积 (SCBD) 集成到聚二甲基硅氧烷 (PDMS) 上，然后进行飞秒 (fs) 激光加工。PDMS 中金纳米粒子的 SCBD 形成了一种纳米复合薄膜，其机械性能与弹性基材的机械性能相似。电中性金属纳米粒子穿透聚合物基质并随机分布至数百纳米的深度，形成欧姆传导路径。在软基板上进行高分辨率图案化是一项主要挑战，通过飞秒激光烧蚀微米线以相对非常小的热损伤克服了这一挑战。微电极的制造宽度低至 3 μm。100 nm 厚膜的印刷金属线薄层电阻为 480 Ohm/square，200 nm 厚膜的印刷金属线电阻为 210 Ohm/square。计算出的平均膜电阻率为 2.5-2.6mΩ·cm。它比物理气相沉积金高约 3 个数量级；因此，它不适用于高电流互连，但足以用于低电流信号传输，例如电和电化学生物传感器。