Active brazing is a commonly used method for joining dissimilar materials with at least one non-metallic component. In the present study, joining of SiO 2 glass to 316L stainless steel was performed utilizing Bi–Ag-based solders. Ti up to a concentration of 4 and Mg up to 1 wt.% were added as active elements. Microstructures of the solder alloys in the as-cast state and of cross sections of the joined compounds were analysed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. In the as-cast state of the solder, Ti is found in Bi–Ti intermetallic phases; Mg is partially dissolved in the fcc-(Ag) phase and additionally contained in a ternary Ag-Bi-Mg phase. After soldering, a tight joint was generated using several alloy compositions. Ti leads to the formation of reaction products at the steel/solder and glass/solder interfaces, and Mg is exclusively accumulated at the glass/solder interface.

中文翻译：

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使用 Bi-Ag 基活性焊料连接 SiO2 玻璃和 316L 不锈钢

主动钎焊是一种将异种材料与至少一个非金属部件连接起来的常用方法。在本研究中，使用 Bi-Ag 基焊料将 SiO 2 玻璃连接到 316L 不锈钢。添加浓度高达 4 的 Ti 和高达 1 wt.% 的 Mg 作为活性元素。使用扫描电子显微镜和能量色散 X 射线光谱分析铸态焊料合金的微观结构和连接化合物的横截面。在焊料的铸态状态下，Ti 存在于 Bi-Ti 金属间相中；Mg 部分溶解在 fcc-(Ag) 相中，另外还包含在三元 Ag-Bi-Mg 相中。焊接后，使用几种合金成分产生紧密的接头。