The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology, the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits (MMIC) operating chip, the 3D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board (PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.

中文翻译：

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基于3D微封装技术的收发器变频模块

提出了基于3D微封装技术的Ku波段收发器变频模块设计思想。通过使用双频转换技术，结合本地振荡器和功率控制电路，实现了从Ku波段到L波段的双收发器电路，以完成放大，滤波和增益等功能。为了实现Ku波段单片微波集成电路（MMIC）操作芯片的性能优化和高集成度，使用了3D垂直互连微装配技术。通过将焊球堆叠在印刷电路板（PCB）上，该技术减小了原始收发器到小型模块的体积。通过特殊的结构设计，该模块具有良好的电磁兼容性。