Abstract The persistent development in modern electronics and communication technologies leads to compact and efficient devices. Conversely, it is accompanied by the downside of enormous heat generation in the constrained space of microelectronic devices. One of the substitutes for the high heat flux dissipation is a liquid cooled Minichannel Heat Sink. However, the drawbacks of higher temperature non-uniformity and higher pressure drop penalty associated with MCHS obliges its all-encompassing utilization. In view of tailing off these issues, a Variable Channel Width Double Layered Minichannel Heat Sink was proposed by the authors and its applicability is experimentally investigated in the present study. A Variable Channel Width Double Layered Minichannel Heat Sink consisting of two layers of MCHS having channels with variable widths in the axial direction are positioned one atop the other in such a way that the denser channel regions of upper and lower layers do not overlap (Zero Overlap). The present research is aimed to develop a test setup to experimentally investigate the influence of various heat flux (11.44 W/cm2- 30.09 W/cm2) and Reynolds number (46 – 138) on the thermal performance of a VWC DL-MCHS with zero overlap and to compare it with the numerical results. The performance of a Variable Channel Width Double Layered Minichannel Heat Sink was analysed in terms of major thermal performance parameters such as thermal resistance (Rth), temperature non-uniformity in the substrate (ΔTS) and total pressure drop (ΔPtotal). The overall thermo-hydraulic performance was evaluated in terms of COP. The agreed comparison between the present experimental and numerical results evidences the aptness of a VWC DL-MCHS geometry for real-life applications. Moreover, a Variable Channel Width Double Layered Minichannel Heat Sink shows significant improvement in overall thermal performance of about 1.53 to 2.35 times than the conventional DL-MCHS. Therefore, a Variable Channel Width Double Layered Minichannel Heat Sink has come out as an improved alternative for the thermal management of high heat flux electronic applications.

中文翻译：

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可变通道宽度双层微通道散热器的实验研究

摘要 现代电子和通信技术的持续发展导致设备紧凑高效。相反，它伴随着微电子设备受限空间中产生巨大热量的缺点。高热通量消散的替代品之一是液冷微型通道散热器。然而，与 MCHS 相关的较高温度不均匀性和较高压降损失的缺点迫使其全面使用。为了解决这些问题，作者提出了一种可变通道宽度双层微通道散热器，并在本研究中对其适用性进行了实验研究。可变通道宽度双层微型通道散热器由两层 MCHS 组成，通道在轴向方向上具有可变宽度的通道，以这样的方式放置在另一个顶部，这样上层和下层的密集通道区域不会重叠（零重叠） ）。本研究旨在开发一种测试装置，通过实验研究各种热通量 (11.44 W/cm2-30.09 W/cm2) 和雷诺数 (46 – 138) 对 VWC DL-MCHS 热性能的影响为零重叠并与数值结果进行比较。根据热阻 (Rth)、基板温度不均匀性 (ΔTS) 和总压降 (ΔPtotal) 等主要热性能参数分析了可变通道宽度双层微通道散热器的性能。根据 COP 评估整体热工水力性能。当前实验和数值结果之间的一致比较证明了 VWC DL-MCHS 几何结构对于现实生活应用的适应性。此外，可变通道宽度双层微通道散热器的整体热性能比传统 DL-MCHS 显着提高约 1.53 至 2.35 倍。因此，可变通道宽度双层微通道散热器已成为高热通量电子应用热管理的改进替代方案。可变通道宽度双层微通道散热器的整体热性能比传统 DL-MCHS 显着提高约 1.53 至 2.35 倍。因此，可变通道宽度双层微通道散热器已成为高热通量电子应用热管理的改进替代方案。可变通道宽度双层微通道散热器的整体热性能比传统 DL-MCHS 显着提高约 1.53 至 2.35 倍。因此，可变通道宽度双层微通道散热器已成为高热通量电子应用热管理的改进替代方案。