In this study, dissimilar butt joints of 1.0 mm thick 6061-T6 aluminum alloy and T2 pure copper ultra-thin sheets were fabricated using micro friction stir welding under various tool traverse speeds while the rotational speed was 3000 rpm. The results indicated that the reliable metallurgical bonding was achieved at Al/Cu interface, which can be attributed to the formation of continuous Al₂Cu-AlCu-Al₄Cu₉ intermetallic compounds (IMCs) layer. A large portion of Cu particles consisting of pure Cu and Al/Cu IMCs were dispersed in the Al matrix and promoted the formation of the composite-like structure. Furthermore, lamellar structure was produced adjacent to the Al/Cu interface. The higher hardness was measured in the nugget zone where a few IMCs were fabricated. The thickness of the interfacial IMCs layer played a significantly role in determining the weld tensile strengths, and the maximum tensile strength of 236.2 MPa (equivalent to 82.9 % of Cu base metal) was obtained, which fractured in the heat affected zone on the aluminum side.

在这项研究中，使用微摩擦搅拌焊接，在转速为3000 rpm的各种工具移动速度下，制造了1.0毫米厚的6061-T6铝合金和T2纯铜超薄板的对接接头。结果表明，在Al / Cu界面实现了可靠的冶金结合，这可以归因于连续Al ₂ Cu-AlCu-Al ₄ Cu _{9的形成。}金属间化合物（IMC）层。由纯Cu和Al / Cu IMC组成的大部分Cu颗粒分散在Al基体中，并促进了复合结构的形成。此外，在Al / Cu界面附近产生了层状结构。在制造一些IMC的熔核区测得较高的硬度。界面IMCs层的厚度在确定焊接抗拉强度方面起着重要作用，最大抗拉强度为236.2 MPa（相当于Cu基金属的82.9％），在铝侧的热影响区断裂。