当前位置: X-MOL 学术Eng. Fract. Mech. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Evaluation of Dynamic Fracture Toughness of a Bonded Bi-Material Interface Subject to High-Strain-Rate Shearing using Digital Image Correlation
Engineering Fracture Mechanics ( IF 5.4 ) Pub Date : 2021-01-01 , DOI: 10.1016/j.engfracmech.2020.107391
Tomohisa Kojima , Yuta Kimura , Shuichi Arikawa , Mitsuo Notomi

Abstract In this study, the fracture toughness at the bi-material interface of layered test pieces is determined using digital image correlation (DIC) measurements as part of dynamic shear tests. High-strain-rate shear tests are conducted on a three-layered bonded test piece comprising a central aluminum layer with PMMA resin layers. When the crack is sufficiently shorter than the bonding interface length, mode II fracture appears at the aluminum–PMMA interface; otherwise, mode I and mode II fractures appear. As the obtained stress intensity factor is consistent with the literature values, a reasonable interface fracture toughness can be evaluated using the DIC measurement.

中文翻译:

使用数字图像相关性评估高应变率剪切下粘合双材料界面的动态断裂韧性

摘要 在这项研究中,使用数字图像相关 (DIC) 测量作为动态剪切试验的一部分来确定分层试件双材料界面的断裂韧性。高应变率剪切试验是在三层粘合试件上进行的,该试件包括中央铝层和 PMMA 树脂层。当裂纹足够短于键合界面长度时,铝-PMMA界面出现II型断裂;否则,出现I型和II型断裂。由于获得的应力强度因子与文献值一致,因此可以使用 DIC 测量来评估合理的界面断裂韧性。
更新日期:2021-01-01
down
wechat
bug