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Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils
Review of Scientific Instruments ( IF 1.6 ) Pub Date : 2020-10-01 , DOI: 10.1063/5.0012404
Manjunath C. Rajagopal 1 , Timothy Man 1 , Adreet Agrawal 1 , Gowtham Kuntumalla 1 , Sanjiv Sinha 1
Affiliation  

Heat conduction through bonded metal-polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential to measure the thermal interfacial resistance (TIR) across ∼1 µm to 100 µm junctions. Previously reported TIR of metal-polymer junctions utilize ASTM E1530-based two-block systems that measure the TIR by applying pressure across the interface through external heating and cooling blocks. Here, we report a novel modification of the ASTM-E1530 technique that employs integrated heaters and sensors to provide an intrinsic TIR measurement of an adhesively bonded metal-polymer junction. We design the measurement technique using finite element simulations to either passively suppress or actively compensate the lateral heat diffusion through the polymer, which can minimize the systematic error to ≲5%. Through proof-of-concept experiments, we report the TIR of metal-polymer interfaces made from DuPont's Pyralux double-side copper-clad laminates, commonly used in flexible printed circuit boards. Our TIR measurement errors are <10%. We highlight additional sources of errors due to non-idealities in the experiment and discuss possible ways to overcome them. Our measurement technique is also applicable to interfaces that are electrically insulating such as adhesively joined metal-metal junctions and sputter-coated or welded metal-polymer junctions. Overall, the technique is capable of measuring TIR ≳10-5 m2 KW-1 in bonded metal-polymer foils and can be tailored for in situ measurements in flexible electronics, circuit packaging, and other hybrid metal-polymer systems.

中文翻译:

粘合金属-聚合物箔中的本征热界面电阻测量

通过粘合的金属-聚合物界面进行的热传导通常会限制电子封装、电池和热回收系统中的整体热传递。要设计此类系统中的热回路,必须测量 ∼1 µm 至 100 µm 结的热界面电阻 (TIR)。先前报道的金属-聚合物接头的 TIR 使用基于 ASTM E1530 的两块系统,该系统通过外部加热和冷却块在界面上施加压力来测量 TIR。在这里,我们报告了 ASTM-E1530 技术的一种新颖修改,该技术采用集成加热器和传感器来提供粘合金属-聚合物结的固有 TIR 测量。我们使用有限元模拟设计测量技术,以被动抑制或主动补偿通过聚合物的横向热扩散,这可以将系统误差最小化至≲5%。通过概念验证实验,我们报告了由杜邦的 Pyralux 双面覆铜层压板制成的金属-聚合物界面的 TIR,通常用于柔性印刷电路板。我们的 TIR 测量误差小于 10%。我们强调了由于实验中的非理想性而导致的其他错误来源,并讨论了克服它们的可能方法。我们的测量技术也适用于电绝缘的界面,例如粘合连接的金属-金属接头和溅射涂层或焊接的金属-聚合物接头。全面的,
更新日期:2020-10-01
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