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An integrated packaged resonant accelerometer with temperature compensation
Review of Scientific Instruments ( IF 1.6 ) Pub Date : 2020-10-01 , DOI: 10.1063/5.0006147
Bo Li 1 , Cun Li 1 , Yulong Zhao 1 , Chao Han 1 , Quanwei Zhang 1
Affiliation  

This paper describes the design, fabrication, and testing of an integrated packaged sensor that is composed of a micro resonant accelerometer and a temperature sensor. The resonant accelerometer with differential configuration consists of double quartz resonators and a silicon substrate. When acceleration is applied along the sensing axis, the inertial force induced by the proof mass will transfer force to the resonators, which causes an opposite frequency shift of the dual quartz resonators. The loaded acceleration can be measured through detecting the differential frequency shift. The symmetric differential configuration response to spurious effects of thermal loading and inelastic effect causing prestress in the resonators is similar, which can be reduced by detecting the differential frequency, effectively. However, during the manufacture and packaging process, the otherness of residual stress in two quartz resonators results in that the response of resonators to temperature variation is not strictly the same. In other words, this temperature drift cannot be eliminated by the structure design. Thus, a temperature sensor and an accelerometer were packaged in a shell together. These novel integrated sensors can measure acceleration and temperature simultaneously. With the testing temperature data, a novel temperature compensation that is a combination of the variable coefficient regression and least squares support vector machine is used for improving the performance of the accelerometer. By means of this compensation and field programmable gate array, a real-time and online compensation is achieved. The tumble testing results indicate that the sensitivity of the accelerometer is ∼16.97 Hz/g. With the temperature compensation, the output drift of the scale factor is improved by 0.605 Hz/g in the full temperature range, which is from 0.072 Hz/g to 0.015 Hz/g. The drift of zero bias is improved from 345 mg to 1.9 mg.

中文翻译:

一种带温度补偿的集成封装谐振加速度计

本文介绍了由微谐振加速度计和温度传感器组成的集成封装传感器的设计、制造和测试。具有差分配置的谐振加速度计由双石英谐振器和硅衬底组成。当沿传感轴施加加速度时,由质量块引起的惯性力会将力传递到谐振器,这会导致双石英谐振器发生相反的频移。加载加速度可以通过检测差分频移来测量。对热负载和非弹性效应在谐振器中引起预应力的寄生效应的对称差分配置响应是相似的,可以通过检测差分频率有效地减少这种响应。然而,在制造和封装过程中,两个石英谐振器的残余应力不同,导致谐振器对温度变化的响应并不完全相同。换句话说,这种温度漂移不能通过结构设计来消除。因此,温度传感器和加速度计一起封装在一个外壳中。这些新颖的集成传感器可以同时测量加速度和温度。根据测试温度数据,采用变系数回归和最小二乘支持向量机相结合的新型温度补偿来提高加速度计的性能。通过这种补偿和现场可编程门阵列,实现了实时在线补偿。翻滚测试结果表明加速度计的灵敏度为~16.97 Hz/g。通过温度补偿,比例因子的输出漂移在整个温度范围内提高了0.605 Hz/g,即从0.072 Hz/g到0.015 Hz/g。零偏压漂移从 345 mg 提高到 1.9 mg。
更新日期:2020-10-01
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