Abstract This paper presents a comprehensive finite element analysis study on the effect of the support and fixation schemes on the dynamic characteristics and fatigue life of electronic assemblies under vibration. In this study, high accuracy finite element (FE) model was created and thoroughly validated with modal analysis experiments in terms of natural frequencies and mode shape. Accordingly, the finite element model was adopted to run the analysis and to investigate the influence of point support configurations on the out-of-plane deformations of the electronic structure and solder area array stress distributions. Additionally, submodeling technique was implemented to thoroughly analyze the most-critical solder interconnect stresses. The simulations results showed that the support type and locations could significantly affect solder stresses and hence the vibration fatigue performance. Finally, this paper suggest an optimum point support design that provides improved electronic assemblies fatigue life and it also provides another support system that could be considered in the accelerated vibration reliability experiments.

中文翻译：

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固定方式对电子封装振动疲劳影响的数值研究

摘要 本文对支撑和固定方案对振动作用下电子组件动态特性和疲劳寿命的影响进行了全面的有限元分析研究。在这项研究中，创建了高精度有限元 (FE) 模型，并在固有频率和振型方面通过模态分析实验进行了彻底验证。因此，采用有限元模型进行分析并研究点支撑配置对电子结构的平面外变形和焊料区域阵列应力分布的影响。此外，还实施了子建模技术以彻底分析最关键的焊料互连应力。模拟结果表明，支撑类型和位置会显着影响焊接应力，从而影响振动疲劳性能。最后，本文提出了一种最佳点支撑设计，该设计可提高电子组件的疲劳寿命，并且还提供了另一种可以在加速振动可靠性实验中考虑的支撑系统。