A negative‐type photosensitive polyimide (PSPI) based on a chain extendable poly(amic acid) (PAA) and a photo‐base generator (PBG) (E)‐1‐piperidino‐3‐(2‐hydroxyphenyl)‐2‐propen‐1‐one (PHPP) have been developed. The chain extendable PAA was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐oxydianiline (ODA) and end‐capped with di‐tert‐butyl dicarbonate (DIBOC) in N‐methyl‐2‐pyrrolidone (NMP), which has a controlled molecular weight for developing in a 2.38 wt% tetramethyl ammonium hydroxide aqueous solution (TMAH_aq) and underwent a chain‐extending reaction during a curing stage. The PSPI was formulated with the polymerization solution (20 wt% in NMP) and PHPP (15 wt% for the polymer). The PSPI showed a sensitivity of 152 mJ cm⁻² and a contrast of 5.9 when exposed to the i‐line, followed by post exposure baking at 160°C for 2 minutes and development with the 2.38 wt% TMAH_aq containing 10 wt% iPrOH at room temperature. A fine negative image with 2‐μm pattern was obtained on a 3‐μm thick film in the contact‐printed mode. After thermal curing at 200°C for 1 hour, the resulting PSPI features low curable temperature, high resolution and excellent mechanical properties.

中文翻译：

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低温可固化，碱显影和负型感光聚酰亚胺，具有高分辨率和机械性能，基于可扩链的聚酰胺酸和光碱产生剂

基于扩链聚（酰胺酸）（PAA）和光碱产生剂（PBG）（E）-1哌啶子基-3-（2-羟基苯基）-2-丙烯的负型光敏聚酰亚胺（PSPI）‐1-1（PHPP）已开发。链延伸的PAA是从3,3'，4,4'-联苯四甲酸二酐（制备BPDA）和4,4'-氧二苯胺（ODA）和封端的与二-叔丁基二碳酸酯（DIBOC中）ñ -甲基-2-吡咯烷酮（NMP），具有可控制的分子量，可在2.38 wt％的四甲基氢氧化铵水溶液（TMAH）中显影_aq）并在固化阶段进行扩链反应。该PSPI配制与聚合溶液（在NMP中20重量％）和PHPP（15％（重量）的聚合物）。该PSPI显示的152毫焦厘米灵敏度^-2和5.9的对比度当暴露于我-line，随后曝光后在160烘烤℃下进行2分钟，并发展与2.38重量％的TMAH_水溶液含有10％（重量）的iPrOH在室温下。在3μm厚的胶片上以接触印刷模式获得了具有2μm图案的精细负像。在200°C下热固化1小时后，所得的PSPI 具有较低的可固化温度，高分辨率和出色的机械性能。