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Dielectric, thermal, and mechanical properties of the OAPOSS@GO hybrids enhanced low-κ epoxy composites
Polymer-Plastics Technology and Materials ( IF 2.7 ) Pub Date : 2020-10-16 , DOI: 10.1080/25740881.2020.1811323
Yongke Zhao 1, 2 , Guomin Song 1, 2 , Guangxin Chen 2, 3 , Zheng Zhou 1, 2 , Qifang Li 1, 2
Affiliation  

ABSTRACT

Herein, a simple strategy was proposed for multi-scale construction of low-κ epoxy composites by adding a kind of polyhedral oligomeric silsesquioxane@graphene oxide hybrids. Results revealed that the dielectric constant of the composites was decreased with increasing the frequency, and it was decreased first and then increased with increasing the fillers loading. The AC resistivity values of the composites were relatively stable over the entire range of measured frequency (higher than 104 Ω·cm). Moreover, the thermal stabilities and tensile properties of the composites were improved greatly by adding only 0.8 wt% fillers.



中文翻译:

OAPOSS @ GO杂化材料的介电,热和机械性能增强了低κ环氧复合材料

摘要

在此,通过添加一种多面体低聚倍半硅氧烷@氧化石墨烯杂化物,提出了一种用于低κ环氧复合材料的多尺度构建的简单策略。结果表明,复合材料的介电常数随频率的增加而降低,随填充量的增加先降低,然后升高。该复合材料的电阻率的AC值分别超过测量的频率(高于10的整个范围内相对稳定4 Ω·厘米)。此外,通过仅添加0.8重量%的填料,极大地改善了复合材料的热稳定性和拉伸性能。

更新日期:2020-10-16
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