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Crosstalk noise analysis in ternary logic multilayer graphene nanoribbon interconnects using shielding techniques
International Journal of Circuit Theory and Applications ( IF 2.3 ) Pub Date : 2020-10-16 , DOI: 10.1002/cta.2889
Tulasi Naga Jyothi Kolanti 1 , Vasundhara Patel Kerehalli Shankar Rao 1
Affiliation  

This paper presents an accurate structure for multilayer graphene nanoribbon (MLGNR) bundled interconnects to reduce the effects of crosstalk in ternary logic circuits. In the proposed structures, the signal line is surrounded by the shielding lines to reduce the crosstalk effects. The crosstalk effects such as noise peak, noise area, delay, and power consumptions are compared to effects produced by conventional methods. The impacts of process variation in the proposed structures are also presented. Additionally, the proposed MLGNR interconnect results are compared with the carbon nanotube interconnections. All the proposed circuits are implemented and simulated using HSPICE tool. The simulation results indicated that the passively shielded MLGNR interconnects provide lower crosstalk effects up to 47.7% and 69.4%, respectively, over the active and without shielded interconnects.

中文翻译:

使用屏蔽技术的三元逻辑多层石墨烯纳米带互连中的串扰噪声分析

本文提出了多层石墨烯纳米带(MLGNR)捆绑互连的精确结构,以减少三元逻辑电路中串扰的影响。在所提出的结构中,信号线被屏蔽线围绕以减少串扰效应。将诸如噪声峰值,噪声区域,延迟和功耗之类的串扰效应与传统方法产生的效应进行了比较。还介绍了工艺变化对拟议结构的影响。此外,将拟议的MLGNR互连结果与碳纳米管互连进行了比较。所有提议的电路均使用HSPICE工具实施和仿真。仿真结果表明,无源屏蔽的MLGNR互连可提供更低的串扰效应,分别高达47.7%和69.4%,
更新日期:2020-12-04
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