Abstract

In this article, the low-temperature (300 °C) sintering process of silver microparticles is modeled based on coupled diffusion mechanisms. Simulations are carried out for the simplest two-particle model and for various multiparticle arrangements. Sintering evolution was studied by evaluating densification, shrinkage rate, grain boundary growth under the effect of low uniaxial sintering pressure (1 to 5 bars). It is found that the gain provided by the applied pressure is limited to the grain boundary diffusion in the early stage of sintering. Sintering of a more complicated randomly-generated aggregate of 40 silver particles is also simulated.

中文翻译：

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基于表面和晶界扩散机制的银微粒低温低压烧结数值模拟

摘要

在本文中，基于耦合扩散机制对银微粒的低温 (300 °C) 烧结过程进行了建模。对最简单的两粒子模型和各种多粒子排列进行了模拟。通过评估低单轴烧结压力（1 至 5 巴）影响下的致密化、收缩率、晶界生长来研究烧结演变。发现施加压力提供的增益仅限于烧结早期的晶界扩散。还模拟了由 40 个银颗粒组成的更复杂的随机生成聚集体的烧结。