Abstract With the development of high frequency and high integration of electronics such as 5G technology, overheating problem becomes an increasingly challenging problem. To address this pressing issue, the designs and innovations of high-performance polymer-based thermal interface materials (TIMs) with excellent heat dissipation ability are urgently demanded. This review summarizes the physical fundamentals, typical types and current status of polymer-based TIMs. We put emphases on the practical application requirement of TIMs, and the strategies for enhancing through-plane thermal conductivity and reducing thermal contact resistance. Perspectives on further research are provided, which will be beneficial to further understand the working mechanisms, advanced processing strategies and practical applications of polymer-based TIMs.

中文翻译：

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用于热管理的基于聚合物的热界面材料的最新进展：小型综述

摘要 随着5G等电子技术的高频化、高集成化的发展，过热问题成为越来越具有挑战性的问题。为了解决这个紧迫的问题，迫切需要具有优异散热能力的高性能聚合物基热界面材料（TIM）的设计和创新。本综述总结了聚合物基 TIM 的物理基础、典型类型和现状。我们将重点放在 TIM 的实际应用需求上，以及提高穿透热导率和降低接触热阻的策略。提供了进一步研究的观点，这将有利于进一步了解聚合物基 TIM 的工作机制、先进的加工策略和实际应用。