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Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-10-15 , DOI: 10.1108/ssmt-05-2020-0020 Yang Gao , Fuwei Wang , Shaohu Ding , Bin Yang , Lin Liu , Mohammad Salmani
中文翻译:
随机振动频率下焊球接头疲劳寿命的器件架构优化
更新日期:2020-10-15
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-10-15 , DOI: 10.1108/ssmt-05-2020-0020 Yang Gao , Fuwei Wang , Shaohu Ding , Bin Yang , Lin Liu , Mohammad Salmani
Purpose
This study aims to investigate the vibration effects on ball grid array lifetime.
Design/methodology/approach
Several finite element method simulations and experiments were performed.
Findings
An optimized circuit configuration was found.
Originality/value
The originality of paper is confirmed by authors.
中文翻译:
随机振动频率下焊球接头疲劳寿命的器件架构优化
目的
这项研究旨在调查振动对球栅阵列寿命的影响。
设计/方法/方法
进行了一些有限元方法模拟和实验。
发现
找到了优化的电路配置。
创意/价值
论文的原创性已被作者确认。