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Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies
Soldering & Surface Mount Technology ( IF 2 ) Pub Date : 2020-10-15 , DOI: 10.1108/ssmt-05-2020-0020
Yang Gao , Fuwei Wang , Shaohu Ding , Bin Yang , Lin Liu , Mohammad Salmani

Purpose

This study aims to investigate the vibration effects on ball grid array lifetime.

Design/methodology/approach

Several finite element method simulations and experiments were performed.

Findings

An optimized circuit configuration was found.

Originality/value

The originality of paper is confirmed by authors.



中文翻译:

随机振动频率下焊球接头疲劳寿命的器件架构优化

目的

这项研究旨在调查振动对球栅阵列寿命的影响。

设计/方法/方法

进行了一些有限元方法模拟和实验。

发现

找到了优化的电路配置。

创意/价值

论文的原创性已被作者确认。

更新日期:2020-10-15
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