Finding an alternative material to gold wire is important to cost reduction for the wire bonding process. The wire materials for laser diodes are required to pass ball shear test, wire pull test and several reliability tests, so that it can be used in production. This research employs the Multi-response Quality Test procedure that investigates the feasibility and optimal conditions of using silver alloy wire in the wire bonding process. The weighted Principal Components Analysis-based Taguchi method is used to determine the optimal parameter combination of the wire bonding process, which can minimize quality loss in multiple tests. The result shows that under the optimal parameter combination of the wire bonding process, silver alloy wire can outperform gold wire by having higher ball bond strength, higher wire strength, and smaller operation current changes after the reliability tests. Substituting gold wire with silver alloy wire can significantly reduce cost by 30% while improving wire bond quality.

寻找替代金线的材料对于降低引线键合工艺的成本很重要。要求激光二极管的线材通过球剪切测试，拉线测试和多项可靠性测试，以便可以在生产中使用。本研究采用了多响应质量测试程序，该程序研究了在引线键合过程中使用银合金线的可行性和最佳条件。基于加权主成分分析的Taguchi方法用于确定引线键合过程的最佳参数组合，从而可以最大程度地减少多次测试中的质量损失。结果表明，在最佳的引线键合工艺参数组合下，银合金线具有较高的球形键合强度，较高的引线强度，可以胜过金线。可靠性测试后，较小的工作电流变化。用银合金线代替金线可以显着降低成本30％，同时提高线键合质量。