Antibacterial and osteogenic functionalization of titanium (Ti) implants will greatly expand their clinical indications in immediate implant therapy, accelerate osteointegration, and enhance long-term prognosis. We had recently shown that the high-energy shot peening (HESP)-assisted micro-arc oxidation (MAO) significantly improved the bioactivity and coating stability of Ti-based substrates. In this study, we further functionalized Ti with antibacterial and osteogenic properties by doping silicon (Si) and/or copper (Cu) ions into HESP/MAO-treated coatings. Physicochemical characterization displayed that the doping of Si and Cu in HESP/MAO-treated coatings (Si/Cu-MAO) did not significantly change their surface topography, roughness, crystal structure, coating thickness, bonding strength, and wettability. The results of X-ray photoelectron spectroscopy (XPS) showed that Si and Cu in the Si/Cu-MAO coating was in the form of silicate radical (SiO32–) and bivalent copper (Cu2+), respectively. The total amounts of Si and Cu were about 13.5 and 5.8 μg/cm2, which released about 33.2 and 31.3% within 14 day, respectively. Compared with the control group (MAO), Si doping samples (MAO-Si) significantly increased the cell viability, alkaline phosphatase (ALP) activity, mineralization and osteogenic genes (ALP, collagen I and osteocalcin) expression of MC3T3-E1 cells. Furthermore, the addition of Cu presented good bactericidal property against both Staphylococcus aureus and Streptococcus mutans (even under the co-culture condition of bacteria and MC3T3-E1 cells): the bacteriostatic rate of both bacteria was over 95%. In conclusion, the novel bioactive Si/Cu-MAO coating with antibacterial and osteogenic properties is a promising functionalization method for orthopedic and dental implants, especially in the immediate implant treatment with an infected socket.

中文翻译：

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硅/铜掺杂高能喷丸辅助微弧氧化技术对钛的抗菌和成骨功能化

钛（Ti）种植体的抗菌和成骨功能化将极大地扩大其在即刻种植治疗中的临床适应症，加速骨整合，提高长期预后。我们最近表明，高能喷丸硬化 (HESP) 辅助的微弧氧化 (MAO) 显着提高了钛基基材的生物活性和涂层稳定性。在这项研究中，我们通过将硅 (Si) 和/或铜 (Cu) 离子掺杂到 HESP/MAO 处理的涂层中，进一步使 Ti 具有抗菌和成骨特性。物理化学表征表明，在 HESP/MAO 处理的涂层 (Si/Cu-MAO) 中掺杂 Si 和 Cu 并未显着改变其表面形貌、粗糙度、晶体结构、涂层厚度、结合强度和润湿性。X射线光电子能谱（XPS）的结果表明，Si/Cu-MAO涂层中的Si和Cu分别以硅酸盐自由基（SiO32-）和二价铜（Cu2+）的形式存在。Si 和 Cu 的总量约为 13.5 和 5.8 μg/cm2，分别在 14 天内释放了约 33.2% 和 31.3%。与对照组（MAO）相比，Si掺杂样品（MAO-Si）显着增加了MC3T3-E1细胞的细胞活力、碱性磷酸酶（ALP）活性、矿化和成骨基因（ALP、I型胶原和骨钙素）的表达。此外，添加Cu对金黄色葡萄球菌和变形链球菌（即使在细菌和MC3T3-E1细胞共培养条件下）均表现出良好的杀菌性能：两种细菌的​​抑菌率均超过95%。综上所述，