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Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
MRS Communications ( IF 1.9 ) Pub Date : 2020-10-07 , DOI: 10.1557/mrc.2020.77 L. Arnaud , C. Karam , N. Bresson , C. Dubarry , S. Borel , M. Assous , G. Mauguen , F. Fournel , M. Gottardi , T. Mourier , S. Cheramy , F. Servant
中文翻译：
三维混合键合集成挑战和多晶圆堆叠解决方案
更新日期：2020-10-07
MRS Communications ( IF 1.9 ) Pub Date : 2020-10-07 , DOI: 10.1557/mrc.2020.77 L. Arnaud , C. Karam , N. Bresson , C. Dubarry , S. Borel , M. Assous , G. Mauguen , F. Fournel , M. Gottardi , T. Mourier , S. Cheramy , F. Servant
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中文翻译：
三维混合键合集成挑战和多晶圆堆叠解决方案
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